PLC control, man-machine interface: big screen color LCD screen + touch screen;
★Three sections of temperature zone heated independently, each zone can be set 6 sections temperature risen + 6 sections temperature constant control at the same time, a total of 50 groups of the temperature curve storage;
The equipment with many sizes of hot air nozzle, or having it made to order according to the special requirements; Hot air nozzle can be under arbitrary rotation 360 degrees, easy to be replaced;
Equipped with adjustable high temperature resistant PCB stents, positioning frame with preventing scalding protection design;
Handheld vacuum pen, sucking BGA, easy for operation, reliable and durable;
The equipment with random hook like heterosexual clip, suitable for motherboard maintenance of different shapes of laptops;
Equipped with industrial high definition CCD camera and LCD monitor, clear to see the entire desoldering process and ensuring welding effect;
★Localization mode: V matrix slot PCB positioning, the maximum suitable PCB size 450×400mm;
Equipped with keeping heat button, more convenient for heating operation control, there is voice alarm function for BGA removing and after the welding;
The upper heating 800 W, lower 800 W, bottom infrared preheated 3000 W;
Power supply: AC220V/5000W;
Overall dimension: 600mm×600mm×620mm;
Weight: 30kg.
