TR-NY-SBG400 BGA precision rework station


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COMPANY : Tryte Technology (H.K.) Limited
ADD : UNIT 04, 7/F, BRIGHT WAY TOWER, NO. 33 MONG KOK ROAD, KOWLOON, HONGKONG.
TEL:00852-2389298
FAX: 00852-35902333
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SITE : www.trytetc.com
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TR-NY-SBG400 BGA precision rework station
  • Name: TR-NY-SBG400 BGA precision rework station
  • Model : TR-NY-SBG400
  • Erp code: 5000000041
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TR-NY-SBG400.jpg

  1.  PLC control, man-machine interface: big screen color LCD screen + touch screen;

  2. ★Three sections of temperature zone heated independently, each zone can be set 6 sections temperature risen + 6 sections temperature constant control at the same time, a total of 50 groups of the temperature curve storage;

  3. The equipment with many sizes of hot air nozzle, or having it made to order according to the special requirements; Hot air nozzle can be under arbitrary rotation 360 degrees, easy to be replaced;

  4. The equipment with random hook like heterosexual clip, suitable for motherboard maintenance of different shapes of laptops;

  5. ★Localization mode: V matrix slot PCB positioning, the maximum suitable PCB size 450×400mm;

  6. Equipped with keeping heat button, more convenient for heating operation control, there is voice alarm function for BGA removing and after the welding;

  7. The upper heating 800 W, lower 800 W, bottom infrared preheated 3000 W;

  8. Power supply: AC220V/5000W;

  9. Overall dimension: 600mm×600mm×620mm;

  10. Weight: 25kg.


  1.  PLC control, man-machine interface: big screen color LCD screen + touch screen;

  2. ★Three sections of temperature zone heated independently, each zone can be set 6 sections temperature risen + 6 sections temperature constant control at the same time, a total of 50 groups of the temperature curve storage;

  3. The equipment with many sizes of hot air nozzle, or having it made to order according to the special requirements; Hot air nozzle can be under arbitrary rotation 360 degrees, easy to be replaced;

  4. The equipment with random hook like heterosexual clip, suitable for motherboard maintenance of different shapes of laptops;

  5. ★Localization mode: V matrix slot PCB positioning, the maximum suitable PCB size 450×400mm;

  6. Equipped with keeping heat button, more convenient for heating operation control, there is voice alarm function for BGA removing and after the welding;

  7. The upper heating 800 W, lower 800 W, bottom infrared preheated 3000 W;

  8. Power supply: AC220V/5000W;

  9. Overall dimension: 600mm×600mm×620mm;

  10. Weight: 25kg.



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