PLC control, man-machine interface: big screen color LCD screen + touch screen;

Three sections of temperature zone heated independently, the first and second zone can be set 8 sections temperature risen + 8 sections temperature constant control at the same time, a total of 10 groups of temperature curve storage; The third temperature zone uses far infrared heating board for preheating, with independent temperature control, ensuring the PCB to an overall preheating during the welding process and preventing deformation;

The equipment with many sizes of hot air nozzle, or having it made to order according to the special requirements; Hot air nozzle can be under arbitrary rotation 360 degrees, easy to be replaced;

Equipped with adjustable high temperature resistant PCB stents, positioning frame with preventing scalding protection design;

Handheld vacuum pen, sucking BGA, easy for operation, reliable and durable;

The equipment with random hook like heterosexual clip, suitable for motherboard maintenance of different shapes of laptops;

★Heating head and paste mounted head integration design, with automatic contrapuntal, automatic mounted and automatic welding function;

With computer communication function, built-in PC serial ports, external temperature measurement interface, realizing computer control;

★Equipped with high definition video contrapuntal system, with spectral amplifier and fine tuning function, with CCD optical contrapuntal function, ensuring accurate BGA device mounted and accurate welding;

Localization mode: V matrix slot PCB positioning, the maximum suitable PCB size 430×400mm;

Chip video magnification: 10-100 times;

Equipped with keeping heat button, more convenient for heating operation control, there is voice alarm function for BGA removing and after the welding;

The upper heating 800 W, lower 800 W, bottom infrared preheated 3000 W;

Power supply: AC220V/5400W;

Overall dimension: 700mm×650mm×800mm;

Weight: 110kg.

PLC control, man-machine interface: big screen color LCD screen + touch screen;

Three sections of temperature zone heated independently, the first and second zone can be set 8 sections temperature risen + 8 sections temperature constant control at the same time, a total of 10 groups of temperature curve storage; The third temperature zone uses far infrared heating board for preheating, with independent temperature control, ensuring the PCB to an overall preheating during the welding process and preventing deformation;

The equipment with many sizes of hot air nozzle, or having it made to order according to the special requirements; Hot air nozzle can be under arbitrary rotation 360 degrees, easy to be replaced;

Equipped with adjustable high temperature resistant PCB stents, positioning frame with preventing scalding protection design;

Handheld vacuum pen, sucking BGA, easy for operation, reliable and durable;

The equipment with random hook like heterosexual clip, suitable for motherboard maintenance of different shapes of laptops;

★Heating head and paste mounted head integration design, with automatic contrapuntal, automatic mounted and automatic welding function;

With computer communication function, built-in PC serial ports, external temperature measurement interface, realizing computer control;

★Equipped with high definition video contrapuntal system, with spectral amplifier and fine tuning function, with CCD optical contrapuntal function, ensuring accurate BGA device mounted and accurate welding;

Localization mode: V matrix slot PCB positioning, the maximum suitable PCB size 430×400mm;

Chip video magnification: 10-100 times;

Equipped with keeping heat button, more convenient for heating operation control, there is voice alarm function for BGA removing and after the welding;

The upper heating 800 W, lower 800 W, bottom infrared preheated 3000 W;

Power supply: AC220V/5400W;

Overall dimension: 700mm×650mm×800mm;

Weight: 110kg.